JP2520610Y2 - リードフレーム - Google Patents
リードフレームInfo
- Publication number
- JP2520610Y2 JP2520610Y2 JP1990029243U JP2924390U JP2520610Y2 JP 2520610 Y2 JP2520610 Y2 JP 2520610Y2 JP 1990029243 U JP1990029243 U JP 1990029243U JP 2924390 U JP2924390 U JP 2924390U JP 2520610 Y2 JP2520610 Y2 JP 2520610Y2
- Authority
- JP
- Japan
- Prior art keywords
- guide hole
- lead
- plating
- pin
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011295 pitch Substances 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990029243U JP2520610Y2 (ja) | 1990-03-22 | 1990-03-22 | リードフレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990029243U JP2520610Y2 (ja) | 1990-03-22 | 1990-03-22 | リードフレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03120047U JPH03120047U (en]) | 1991-12-10 |
| JP2520610Y2 true JP2520610Y2 (ja) | 1996-12-18 |
Family
ID=31532014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990029243U Expired - Fee Related JP2520610Y2 (ja) | 1990-03-22 | 1990-03-22 | リードフレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2520610Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6050349B2 (ja) * | 1980-07-09 | 1985-11-08 | 住友金属鉱山株式会社 | リ−ドフレ−ムの製造方法 |
| JPS62183154A (ja) * | 1986-02-06 | 1987-08-11 | Hitachi Cable Ltd | 半導体装置用リ−ドフレ−ム |
-
1990
- 1990-03-22 JP JP1990029243U patent/JP2520610Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03120047U (en]) | 1991-12-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |